Professional 3D printing made accessible.

Introducing the

Ultimaker S5

Pro Bundle

Ultimaker's unique production solution gives busy engineers and designers the freedom to focus all day on doing their best work. Transform your office 3D printing workflow with automated material handling, air filtration, and filament humidity control. The Ultimaker S5 Pro Bundle boosts productivity, flexibility, and confidence to unlock demanding applications with an extended range of materials.​

The Pro Bundle includes: 

Ultimaker S5

Ultimaker S5 Material Station

Ultimaker S5 Air Manager

  • Build Area of 330 x 240 x 300mm

  • Layer resolution:  Down to 20 microns

  • Heated Glass Build Plate

  • Optimized for Tough PLA, PLA, Nylon, ABS, CPE, CPE+, PC, TPU 95A, PP, PVA and Breakaway

  • Connectivity:  Wi-Fi, LAN, USB Port

  • Monitoring:  Live Camera

  • Supplied Software:  Ultimaker Cura, Ultimaker Connect, and Ultimaker Cloud

  • Build Area of 215 x 215 x 200mm

  • Layer resolution:  0.4mm nozzle; 20 - 200 microns

  • XYZ resolution 12.5, 1.5, 2.5 micron

  • Heated Glass Build Plate

  • Optimized for Nylon, PLA, ABS, CPE, PVA

  • Connectivity:  Wi-Fi, LAN, USB Port

  • Monitoring:  Live Camera

  • Build Area of 223 x 223 x 205mm

  • Layer resolution:  0.4mm nozzle; 20 - 200 microns

  • XYZ resolution 12.5, 12.5, 5 micron

  • Heated Glass Build Plate

  • Optimized for PLA, ABS, CPE

  • Connectivity:  SD Card

  • Build Area of 230 x 190 x 200mm

  • Layer resolution:  Down to 20 microns

  • Heated Glass Build Plate

  • Optimized for Tough PLA, PLA, Nylon, ABS, CPE, CPE+, PC, TPU 95A, PP, PVA and Breakaway

  • Connectivity:  Wi-Fi, LAN, USB Port

  • Monitoring:  Live Camera

  • Supplied Software:  Ultimaker Cura, Ultimaker Connect, and Ultimaker Cloud

  • Build Area of 215 x 215 x 300mm

  • Layer resolution:  0.4mm nozzle; 20 - 200 microns

  • XYZ resolution 12.5, 1.5, 2.5 micron

  • Heated Glass Build Plate

  • Optimized for Nylon, PLA, ABS, CPE, PVA

  • Connectivity:  Wi-Fi, LAN, USB Port

  • Monitoring:  Live Camera

  • Build Area of 223 x 223 x 305mm

  • Layer resolution:  0.4mm nozzle; 20 - 200 microns

  • XYZ resolution 12.5, 12.5, 5 micron

  • Heated Glass Build Plate

  • Optimized for PLA, ABS, CPE

  • Connectivity:  SD Card